The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Nov. 27, 2019
Mitsubishi Electric Corporation, Tokyo, JP;
Hiroya Sannai, Tokyo, JP;
Seiichiro Inokuchi, Tokyo, JP;
Yuji Imoto, Tokyo, JP;
Arata Iizuka, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An insulating substrate () is provided on a base plate (). A semiconductor device (-) is provided on the insulating substrate (). A case () is arranged to surround the insulating substrate and the semiconductor device and bonded to the base plate () with an adhesive (). A sealant () seals the insulating substrate and the semiconductor device in the case (). A groove () is provided on a lower surface of the case () opposing an upper surface peripheral portion of the base plate (). A bottom surface of the groove () has a protruding part () protruding toward the base plate (). The protruding part () includes a vertex () and gradients () respectively provided on an inner side and on an outer side of the case () with the vertex () sandwiched therebetween. The adhesive () contacts the vertex () and is housed in the groove ().