The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Nov. 11, 2021
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yi-Hung Lin, Miao-Li County, TW;
Wen-Hsiang Liao, Miao-Li County, TW;
Cheng-Chi Wang, Miao-Li County, TW;
Yi-Chen Chou, Miao-Li County, TW;
Fuh-Tsang Wu, Miao-Li County, TW;
Ker-Yih Kao, Miao-Li County, TW;
Assignee:
Innolux Corporation, Miaoli County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/566 (2013.01); H01L 21/0214 (2013.01); H01L 21/02164 (2013.01); H01L 21/4857 (2013.01); H01L 23/3192 (2013.01); H01L 2224/82005 (2013.01);
Abstract
A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.