The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
May. 14, 2021
Tdk Corporation, Tokyo, JP;
Kyosuke Inui, Tokyo, JP;
Makoto Morita, Tokyo, JP;
Takashi Kudo, Tokyo, JP;
Toshiyuki Anbo, Tokyo, JP;
Kyohei Tonoyama, Tokyo, JP;
Fuyuki Miura, Tokyo, JP;
Masanori Sugai, Tokyo, JP;
Eietsu Abe, Tokyo, JP;
Toru Tonogai, Tokyo, JP;
Yuichi Oyanagi, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.