The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Mar. 29, 2022
Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;
Jianwei Yao, Shandong, CN;
Benzheng Dong, Shandong, CN;
Fabu Xu, Shandong, CN;
Dongmei Yu, Shandong, CN;
Fei Liu, Shandong, CN;
Congwen Luo, Shandong, CN;
Jianwei Mu, Shandong, CN;
HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong, CN;
Abstract
This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.