The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Mar. 02, 2021
Applicant:

Asia Vital Components (China) Co., Ltd., Shenzhen, CN;

Inventors:

Xiao-Xiang Zhao, Shenzhen, CN;

Chun-Lin Mao, Shenzhen, CN;

Han-Min Liu, Shenzhen, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 25/20 (2006.01); H05B 3/00 (2006.01); H05B 3/08 (2006.01); H05B 3/12 (2006.01); H05B 3/40 (2006.01);
U.S. Cl.
CPC ...
G01N 25/20 (2013.01); H05B 3/0019 (2013.01); H05B 3/08 (2013.01); H05B 3/12 (2013.01); H05B 3/40 (2013.01); H05B 2203/016 (2013.01);
Abstract

A heat source simulation structure includes a heating body and a heating member to form a simulation heat source main body for conducting heat. The simulation heat source main body is enclosed in an outer case and a heating substrate with electrical insulation and heat insulation properties to avoid dissipation of the heat. The heating member is electrically connected with an external power supply for heating the heating body. A thermocouple member is disposed on the heating body corresponding to the heating member. A temperature monitoring port is connected with a data collection meter for recording the temperature of the heating body. By means of the heat insulation design enclosing the simulation heat source main body, the contact thermal resistance between the heating member and the heating body is reduced, further to lower the heat loss of the heat source simulation structure and enhance the measurement precision and reliability.


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