The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Apr. 29, 2021
Applicant:
Ntn Corporation, Osaka, JP;
Inventors:
Tomonori Yamashita, Aichi, JP;
Yoshinori Ito, Aichi, JP;
Daisuke Takeda, Aichi, JP;
Yuta Ohashi, Aichi, JP;
Assignee:
NTN CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 5/00 (2006.01); C22C 33/02 (2006.01); C22C 38/00 (2006.01); C22C 38/16 (2006.01); F16C 33/10 (2006.01); F16C 33/12 (2006.01); F16C 33/14 (2006.01);
U.S. Cl.
CPC ...
F16C 33/121 (2013.01); B22F 5/00 (2013.01); C22C 33/0278 (2013.01); C22C 38/00 (2013.01); C22C 38/008 (2013.01); C22C 38/16 (2013.01); F16C 33/10 (2013.01); F16C 33/104 (2013.01); F16C 33/128 (2013.01); F16C 33/14 (2013.01); F16C 33/145 (2013.01); B22F 2998/10 (2013.01); F16C 2204/10 (2013.01); F16C 2204/60 (2013.01); F16C 2240/48 (2013.01); Y10T 428/12014 (2015.01);
Abstract
Provided is a sintered bearing formed mainly of an iron structure () and a copper structure () which are formed of a partially diffusion-alloyed powder () of an iron powder () and a copper powder (). The sintered bearing includes a copper structure () formed of a granular elemental copper powder (') having a grain diameter of 45 μm or less, the ratio of the copper structure () being 10 mass % or less. With this, a further increase in strength of the sintered bearing can be realized.