The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Sep. 29, 2019
Applicant:

Zhejiang Third Age Material Technology Co., Ltd., Zhejiang, CN;

Inventors:

Shuzhen Chen, Zhejiang, CN;

Rui Li, Zhejiang, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/00 (2006.01); C08G 77/12 (2006.01); C08J 3/12 (2006.01);
U.S. Cl.
CPC ...
C08G 77/70 (2013.01); C08G 77/12 (2013.01); C08J 3/12 (2013.01); C08J 2383/05 (2013.01);
Abstract

Disclosed is a preparation method for a polysiloxane powder filler. The method comprises: providing polysiloxane which contains at least 60 wt % of T unit, wherein T unit is equal to RSiO, Ris a hydrogen atom or an independently selected organic group comprising 1-18 carbon atoms; and performing heat treatment on the polysiloxane under inert gas atmosphere or vacuum conditions, wherein the heat treatment temperature is 250 to 750 degrees, such that silicon hydroxyl groups in the polysiloxane are condensed to obtain a polysiloxane powder filler having a true density greater than or equal to 1.33 g/cmand more preferably greater than or equal to 1.34 g/cm. The polysiloxane powder filler obtained by the described preparation method has low inductivity, low inductivity loss and low radioactivity; and can be used for semiconductor packaging materials, circuit boards and intermediate semi-finished products thereof, and semi-cured sheets or copper clad laminates of high-frequency high-speed circuit boards.


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