The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Mar. 20, 2023
Applicants:

Hyundai Transys Incorporated, Seosan-si, KR;

Mujin Co., Ltd., Yangsan-si, KR;

Inventors:

Hye Rin Choi, Hwaseong-si, KR;

Jun Ho Song, Hwaseong-si, KR;

Jae Hong Woo, Yangsan-si, KR;

Seung Keon Woo, Yangsan-si, KR;

Assignees:

HYUNDAI TRANSYS INCORPORATED, Seosan-si, KR;

MUJIN CO., LTD., Yangsan-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B60N 2/58 (2006.01); A44B 18/00 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 5/24 (2006.01); B32B 5/26 (2006.01); B32B 37/06 (2006.01); B32B 37/08 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); B60N 2/70 (2006.01); B60N 2/72 (2006.01); C09J 5/06 (2006.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 7/35 (2018.01); C08K 3/34 (2006.01);
U.S. Cl.
CPC ...
B60N 2/5891 (2013.01); A44B 18/0073 (2013.01); B32B 5/022 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 5/265 (2021.05); B32B 37/06 (2013.01); B32B 37/08 (2013.01); B32B 37/10 (2013.01); B32B 37/1207 (2013.01); B60N 2/5833 (2013.01); B60N 2/5875 (2013.01); B60N 2/7017 (2013.01); B60N 2/72 (2013.01); C09J 5/06 (2013.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 7/35 (2018.01); A44B 18/00 (2013.01); B32B 2037/1215 (2013.01); B32B 2250/02 (2013.01); B32B 2255/26 (2013.01); B32B 2262/0284 (2013.01); B32B 2305/18 (2013.01); B32B 2307/748 (2013.01); B32B 2309/02 (2013.01); B32B 2605/003 (2013.01); B32B 2605/08 (2013.01); C08K 3/346 (2013.01); C09J 2203/358 (2020.08); C09J 2301/408 (2020.08); C09J 2400/10 (2013.01); C09J 2467/00 (2013.01); C09J 2475/00 (2013.01);
Abstract

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.


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