The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Jul. 06, 2023
Japan Display Inc., Tokyo, JP;
Japan Display Inc., Tokyo, JP;
Abstract
According to an aspect, a pressure bonding device is configured to bond, to a plate-like first workpiece having a curved surface part, a plurality of plate-like second workpieces smaller than the first workpiece. The pressure bonding device includes: a vacuum chamber; a stage disposed in the vacuum chamber and having a shape extending along a first surface of the curved surface part of the first workpiece so as to fix the first surface on the stage; and a bonding unit configured to deform an elastic diaphragm by internal pressure and pressure-bond one of the second workpieces to a second surface of the first workpiece. A plurality of the bonding units are disposed facing the stage.