The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jan. 05, 2022
Applicant:

Samsung E&a Co., Ltd., Seoul, KR;

Inventors:

Ho Sung Na, Hanam-si, KR;

Dong Hyun Kim, Seoul, KR;

Kwan Seon Hong, Seoul, KR;

Hye Jin Ryu, Hanam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28B 11/08 (2006.01); B28B 1/00 (2006.01); B33Y 30/00 (2015.01); B33Y 40/20 (2020.01);
U.S. Cl.
CPC ...
B28B 11/0845 (2013.01); B28B 1/001 (2013.01); B33Y 30/00 (2014.12); B33Y 40/20 (2020.01);
Abstract

The present invention relates to a 3D printer for construction for printing and forming various structures wherein a rollerfollows a nozzlewhich discharges concrete, mortar, or the like, to bring an outer peripheral surface of the rollerto be in close contact with a surface of the printed object, and thus the surface of the printed object is flattened. According to the present invention, a high-degree surface flattening work can be performed on the surface of a printed object simultaneously as the printed object is printed by a 3D printer for construction, thus enabling rapid and reliable flattening of the printed object and smooth surface forming.


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