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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12128494 B1

PDFFull Text
Date of Patent:
Oct. 29, 2024

Filed:

May. 15, 2023

Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Brent Elliot, Cupertino, CA (US);

Guleid Hussen, San Francisco, CA (US);

Jason Stephens, San Francisco, CA (US);

Michael Parker, Brentwood, CA (US);

Alfred Grant Elliot, Palo Alto, CA (US);

Assignee:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Attorney:

Burris Law, PLLC

Primary Examiner:

Alex B Efta

Int. Cl.
CPC ...
C04B 35/581 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 1/19 (2006.01); B23K 35/28 (2006.01); B32B 9/00 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/008 (2013.01); B23K 1/19 (2013.01); B23K 35/286 (2013.01); B32B 9/005 (2013.01); C04B 35/581 (2013.01); C04B 37/005 (2013.01); C04B 37/026 (2013.01); H01L 21/67126 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); B23K 2103/52 (2018.08); C04B 2235/6581 (2013.01); C04B 2237/123 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/68 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/80 (2013.01); C04B 2237/84 (2013.01);
Abstract

A method for the joining of ceramic pieces includes applying a layer of titanium on a first ceramic piece and applying a layer of titanium on a second ceramic piece; applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece; applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece; assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween; pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece; heating the first ceramic piece and the second ceramic piece to a joining temperature in a vacuum; and cooling the first ceramic piece and the second ceramic piece. A hermetic seal is formed between the first ceramic piece and the second ceramic piece.

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