The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Feb. 27, 2019
Applicant:

Acr Ii Glass America Inc., Nashville, TN (US);

Inventor:

Olivier Farreyrol, Machtum, LU;

Assignee:

ACR II GLASS AMERICA INC., Nashville, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H01R 4/62 (2006.01); H01R 12/53 (2011.01); H01R 12/57 (2011.01); H01R 43/02 (2006.01); H05B 3/84 (2006.01); H01Q 1/12 (2006.01); H01Q 1/36 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0008 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H01R 4/625 (2013.01); H01R 12/53 (2013.01); H01R 12/57 (2013.01); H01R 43/02 (2013.01); H05B 3/84 (2013.01); H01Q 1/1278 (2013.01); H01Q 1/364 (2013.01); H05B 2203/016 (2013.01); H05B 2203/017 (2013.01);
Abstract

A method of producing a vehicle glass assembly includes (A) providing a harness including a metal wire, a connector at a terminal of the metal wire, including a flat portion made of a metal plate, and a block of lead-free solder, containing tin as a major component, soldered on the flat portion of the connector; (B) providing a glass substrate layer over which a conductive layer, including an electrically conductive wire pattern and a connecting terminal, is formed; (C) sandwiching the block between the flat portion of the connector and the connecting terminal of the conductive layer, and then melting the block to form a solder connection between the connector and the connecting terminal; wherein the amount of the lead-free solder is between 4 mg and 13 mg.


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