The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Nov. 27, 2019
Applicant:

Mgi Tech Co., Ltd., Shenzhen, CN;

Inventors:

Liang Wang, Newark, CA (US);

Jian Gong, Danville, CA (US);

Yan-You Lin, Fremont, CA (US);

Shifeng Li, Fremont, CA (US);

Assignee:

MGI Tech Co., Ltd., Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01J 19/00 (2006.01); B01L 3/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B01J 19/0046 (2013.01); B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); B01J 2219/00529 (2013.01); B01J 2219/00662 (2013.01); B01L 2300/0819 (2013.01); H01L 24/73 (2013.01); H01L 2224/32059 (2013.01); H01L 2224/32137 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83136 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83951 (2013.01);
Abstract

An apparatus () including multiple biological chips () includes a substrate (), a first adhesive layer () disposed on the substrate (), a first biological chip () and a second biological chip () disposed on the first adhesive layer () and attached to the substrate () by the adhesive layer (). The apparatus () further includes a filler () disposed between the first biological chip () and the second biological chip (). The filler () includes a second adhesive layer () extending between a side surface () of the first biological chip () and a side surface () of the second biological chip (), the second adhesive layer () attaching the first biological chip () to the second biological chip (). The filler () also includes a surface layer () disposed over the second adhesive layer (). The surface layer () has a hydrophobic surface that is co-planar with a top surface () of the first biological chip () and a top surface () of the second biological chip ().


Find Patent Forward Citations

Loading…