logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12127445 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

Oct. 22, 2021

Display apparatus

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Yugwang Jeong, Yongin-si, KR;

Daesoo Kim, Yongin-si, KR;

Sungwon Cho, Yongin-si, KR;

Subin Bae, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:

Lewis Roca Rothgerber Christie LLP

Primary Examiner:

Tan N Tran

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H10K 59/12 (2023.01); H10K 59/121 (2023.01); H10K 59/123 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/123 (2023.02); H01L 27/1225 (2013.01); H01L 27/124 (2013.01); H01L 27/1251 (2013.01); H01L 27/1255 (2013.01); H01L 29/78648 (2013.01); H01L 29/78675 (2013.01); H01L 29/7869 (2013.01); H10K 59/1201 (2023.02); H10K 59/1213 (2023.02); H10K 59/1216 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02);
Abstract

A display apparatus includes: a substrate; a first semiconductor layer on the substrate, and including a silicon semiconductor; a second semiconductor layer on the first semiconductor layer, and including an oxide semiconductor; a first conductive layer on the second semiconductor layer; at least one metal layer between the first semiconductor layer and the first conductive layer; and a first contact hole to electrically connect the first semiconductor layer to the first conductive layer. An inner surface of the first contact hole includes a side surface of the at least one metal layer.

Find Patent Forward Citations

Loading…