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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12127362 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

Jun. 20, 2017

Encapsulated printed circuit board and a method of encapsulating a printed circuit board

Applicant:

Black & Decker Inc., New Britain, CT (US);

Inventors:

Michael Varipatis, Fallston, MD (US);

Nathan J. Osborne, Baltimore, MD (US);

Alfred M. Irungu, Nottingham, MD (US);

Ryan Klee, Baltimore, MD (US);

Nicholas J. Garibaldi, Baltimore, MD (US);

William T. Lunsford, V, Bel Air, MD (US);

Nathan J. Cruise, Phoenix, MD (US);

Assignee:

BLACK & DECKER INC., New Britain, CT (US);

Attorney:

Michael Aronoff

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 7/02 (2006.01); G06F 1/16 (2006.01); H01M 10/42 (2006.01); H01M 50/186 (2021.01); H01M 50/284 (2021.01); B29L 31/00 (2006.01); H01M 50/184 (2021.01); H01M 50/204 (2021.01); H01M 50/227 (2021.01); H01M 50/247 (2021.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); G06F 1/1635 (2013.01); H01M 10/425 (2013.01); H01M 50/186 (2021.01); H01M 50/284 (2021.01); B29L 2031/7146 (2013.01); H01M 50/184 (2021.01); H01M 50/204 (2021.01); H01M 50/227 (2021.01); H01M 50/247 (2021.01); H01M 2220/30 (2013.01); H05K 3/284 (2013.01); H05K 2201/10189 (2013.01);
Abstract

The present disclosure is directed to an encapsulated printed circuit board populated with a variety of components and a method of encapsulating a printed circuit board. The printed circuit board is partially encapsulated with a low pressure molded material to form at least a portion of a potting boat. The potting boat is filled with an encapsulating material.

Find Patent Forward Citations

Varipatis, Michael. (2024). Encapsulated printed circuit board and a method of encapsulating a printed circuit board (U.S. Patent No. 12127362). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12127362

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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