The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Apr. 29, 2021
Zkw Group Gmbh, Wieselburg, AT;
ZKW Group GmbH, Wieselburg, AT;
Abstract
A method for soldering an SMD component to a circuit carrier in a positionally stable manner, includes: a) providing a circuit carrier including a printed circuit board (PCB) contact surface, which is coated with a soldering paste (SP); b) applying an adhesive point onto the circuit carrier wherein the adhesive point delimits the PCB contact surface coated with SP; c) placing an SMD component, which includes a component contact surface, on the PCB contact surface coated with SP wherein the component contact surface contacts the PCB contact surface via the SP and the SMD component rests on the SP without contacting the adhesive point; d) waiting to complete a curing process of the adhesive point; and e) heating, melting and subsequently cooling the SP to produce an electric, thermal and/or a mechanical connection between the component and PCB contact surfaces, wherein the SMD component is allowed to vertically sink in molten SP and is mechanically restricted from drifting horizontally on the molten SP by means of a barrier.