The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Feb. 26, 2019
Applicant:

Teradyne, Inc., North Reading, MA (US);

Inventors:

Heng-Kit Too, Oak Park, CA (US);

Xue-Bin Tan, Shanghai, CN;

Max Zhang, Shanghai, CN;

Rocky Tao, Shanghai, CN;

Brian Brecht, Newbury Park, CA (US);

Iris Weng, Shanghai, CN;

Hale Deng, HeFei, CN;

Assignee:

Dis Tech America, LLC, North Reading, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); G01R 1/073 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B23K 1/0008 (2013.01); G01R 1/07378 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 3/3463 (2013.01); B23K 2101/42 (2018.08); H05K 2201/068 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0195 (2013.01);
Abstract

An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.


Find Patent Forward Citations

Loading…