The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Jun. 23, 2023
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Michael David Hill, Emmitsburg, MD (US);

Jianzhong Jiang, Leesburg, VA (US);

Jeffrey Alan Shunkwiler, Adamstown, MD (US);

Neil Bruce Coats, Walkersville, MD (US);

David Martin Firor, Thurmont, MD (US);

David Bowie Cruickshank, Rockville, MD (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 18/00 (2006.01); C04B 35/26 (2006.01); C04B 35/495 (2006.01); C04B 37/00 (2006.01); H01L 21/8258 (2006.01); H01P 1/36 (2006.01); H01P 1/38 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/36 (2013.01); B32B 18/00 (2013.01); C04B 35/265 (2013.01); C04B 35/2675 (2013.01); C04B 35/495 (2013.01); C04B 37/001 (2013.01); H01L 21/8258 (2013.01); H01P 1/38 (2013.01); H01P 11/003 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/3203 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3239 (2013.01); C04B 2235/3256 (2013.01); C04B 2235/3258 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/764 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/34 (2013.01); C04B 2237/84 (2013.01);
Abstract

Disclosed herein are embodiments of low temperature co-fireable dielectric materials which can be used in conjunction with high dielectric materials to form composite structures, in particular for isolators and circulators for radiofrequency components. Embodiments of the low temperature co-fireable dielectric materials can be scheelite or garnet structures, for example barium tungstate. Adhesives and/or glue is not necessary for the formation of the isolators and circulators.


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