The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

May. 13, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Chia Che Chiang, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 49/02 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 28/92 (2013.01); H10B 12/033 (2023.02); H10B 12/31 (2023.02);
Abstract

A manufacturing method of a semiconductor structure includes forming a dielectric layer stack including a first oxide layer and a second oxide layer over the first oxide layer. An opening is formed in the dielectric layer stack, and includes a first portion exposing sidewalls of the first oxide layer and a second portion exposing sidewalls of the second oxide layer. A sacrificial layer is formed over the dielectric layer stack and along the sidewalls of the first oxide layer and the second oxide layer in the opening. A first etching is performed to remove the sacrificial layer along the sidewalls of the first oxide layer. A second etching is performed to widen the first portion of the opening. The sacrificial layer along the sidewalls of the second oxide layer and over the dielectric layer stack is removed. A capacitor is formed in the opening after removing the sacrificial layer.


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Chiang, Chia. (2024). Semiconductor structure and manufacturing method thereof (U.S. Patent No. 12125875). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12125875

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