The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Dec. 19, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Chee-Pin T'Ng, Penang, MY;
Sai-Mun Lee, Penang, MY;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G01J 1/02 (2006.01); G01J 3/02 (2006.01); G01J 3/10 (2006.01); G01S 7/481 (2006.01); G01S 17/04 (2020.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G01J 1/0214 (2013.01); G01J 3/0227 (2013.01); G01J 3/0256 (2013.01); G01J 3/0262 (2013.01); G01J 3/108 (2013.01); G01S 7/4813 (2013.01); G01S 17/04 (2020.01); H01L 25/50 (2013.01); H01L 2924/0002 (2013.01);
Abstract
There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.