The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
May. 24, 2023
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Kazuaki Mawatari, Kariya, JP;
Shinji Kawano, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G01L 9/00 (2006.01); G01L 19/06 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); G01L 9/00 (2013.01); G01L 19/06 (2013.01); H01L 24/03 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 29/84 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/8592 (2013.01);
Abstract
A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.