The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Apr. 20, 2022
Applicant:
Hitachi Energy Ltd, Zürich, CH;
Inventors:
Assignee:
HITACHI ENERGY LTD, Zürich, CH;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/4871 (2013.01); H01L 2023/4087 (2013.01);
Abstract
A clamping element () is specified configured to be pressed to a baseplate () of at least one power semiconductor module () comprising a mold (), comprising —at least one contact area () being configured to be in direct contact to at least one clamping area () of the baseplate () being free of the mold (), and —at least one recess () provided in the baseplate, wherein —the recess () and the contact area () are configured to face the baseplate. Further, a method for producing a power semiconductor device is specified.