The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Feb. 01, 2022
Fuji Electric Co., Ltd., Kawasaki, JP;
Yuko Nakamata, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A semiconductor device in which even when cracks occur in a sealing material, the entry of moisture through the cracks can be prevented. A semiconductor device comprising a semiconductor elementmounted on a laminated substrateand an electrically conductive connecting member, and a sealing material which seals the semiconductor element and the electrically conductive connecting member, wherein the sealing material includes a sealing layersealing members to be sealed including the laminated substratethe semiconductor elementand the electrically conductive connecting member and including a thermosetting resin, and a protective layercoating the sealing layer and including a silicone rubber, and wherein a value Aof a tensile strength × elongation at break of the sealing layeris less than a value Aof a tensile strength × elongation at break of the protective layerand the Ais 1600 MPa or less.