The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Jan. 05, 2022
Applicant:

Asti Global Inc., Taiwan, Taichung, TW;

Inventor:

Te-Fu Chang, Taichung, TW;

Assignee:

ASTI GLOBAL INC., TAIWAN, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of releasing a selected light-emitting diode chip from a plurality of light-emitting diode chips each of which has a p-type electrode, an n-type electrode and a central portion between the p-type electrode and the n-type electrode, comprising steps of: providing a first substrate with the plurality of light-emitting diode chips bonded thereon and spaced from each other in a pitch; and applying a laser spot generated from a laser energy source to reduce a bonding force between the selected light-emitting diode chip and the first substrate, thereby making the selected light-emitting diode chip release from the first substrate; wherein the laser spot has a coverage over the p-type electrode and the n-type electrode of the selected light-emitting diode chip, and the coverage has a length less than the pitch.


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