The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Mar. 22, 2022
Applicant:

Ferric Inc., New York, NY (US);

Inventors:

Michael Lekas, Brooklyn, NY (US);

Salahuddin Raju, Long Island City, NY (US);

Noah Sturcken, New York, NY (US);

Ryan Davies, New York, NY (US);

Denis Shishkov, Brooklyn, NY (US);

Assignee:

Ferric Inc., New York, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01F 17/00 (2006.01); H01F 41/32 (2006.01); H01L 21/02 (2006.01); H01L 21/324 (2006.01); H01L 21/78 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3205 (2013.01); H01F 41/32 (2013.01); H01L 21/02172 (2013.01); H01L 21/324 (2013.01); H01L 21/7806 (2013.01); H01L 23/5227 (2013.01); H01F 17/0033 (2013.01); H01L 28/10 (2013.01);
Abstract

A method for manufacturing a ferromagnetic-dielectric composite material comprises: (a) placing patterned ferromagnetic layer regions, in a patterning substrate assembly that includes a patterning substrate and a first dielectric layer, in physical contact with a second dielectric layer, the second dielectric layer in a receiving substrate assembly that includes a receiving substrate, (b) forming a bond between the patterned ferromagnetic layer regions and the second dielectric layer; (c) releasing the patterning substrate from the patterning substrate assembly to transfer the patterned ferromagnetic layer regions and the first dielectric layer from the patterning substrate assembly to the receiving substrate assembly; and (d) releasing the receiving substrate from the receiving substrate assembly to form the ferromagnetic-dielectric composite material.


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