The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
May. 19, 2021
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventor:
Mingle Tong, Sunnyvale, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 14/54 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32495 (2013.01); C23C 14/545 (2013.01); C23C 16/52 (2013.01); H01J 37/32715 (2013.01); H01J 37/32899 (2013.01); H01L 21/02274 (2013.01); H01L 21/0332 (2013.01); H01L 22/26 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01);
Abstract
Exemplary semiconductor processing systems may include a chamber body having sidewalls and a base. The semiconductor processing systems may include a substrate support extending through the base of the chamber body. The substrate support may include a support plate. The substrates support may include a shaft coupled with the support plate. The semiconductor processing systems may include a liner positioned within the chamber body and positioned radially outward of a peripheral edge of the support plate. An inner surface of the liner may include an emissivity texture.