The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Sep. 24, 2020
Koa Corporation, Nagano, JP;
Yasushi Akahane, Nagano, JP;
Nobuhiko Tamada, Nagano, JP;
KOA CORPORATION, Nagano, JP;
Abstract
A chip componentcomprises: an insulating substrateon which a resistorserving as a functional element is formed; a pair of internal electrodes (front electrodes, end surface electrodes, and back electrodes) that is formed to cover both end portions of the insulating substrateand connected to the resistor; a barrier layerthat is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layerthat is formed on a surface of the barrier layerand mainly composed of tin, and the barrier layeris composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layerhas magnetic properties.