The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Oct. 09, 2023
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Manabu Uehara, Kawasaki Kanagawa, JP;

Yuu Kawai, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 3/12 (2006.01); G11B 19/20 (2006.01); G11B 25/04 (2006.01); G11B 33/12 (2006.01); G11B 33/14 (2006.01); G11B 5/48 (2006.01); G11B 33/04 (2006.01);
U.S. Cl.
CPC ...
G11B 33/122 (2013.01); G11B 19/2009 (2013.01); G11B 25/043 (2013.01); G11B 33/1446 (2013.01); G11B 5/4813 (2013.01); G11B 33/0472 (2013.01); G11B 33/126 (2013.01); G11B 33/128 (2013.01);
Abstract

According to one embodiment, a disk device includes a housing with a bottom wall, magnetic disks supported on a hub of a motor, a printed circuit board provided on an outer surface of the bottom wall, and a wiring board attached on the outer surface of the bottom wall. The bottom wall includes a recess formed in the outer surface, a step located on border between the outer surface and the recess, and through holes opened to the recess. The wiring board includes one end portion disposed in the recess and connection pads on the one end portion, connected to lead wires of a coil. An adhesive is filled into the recess and the through holes, and covers the one end and a solder joint and seals the through holes.


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