The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Dec. 06, 2019
Applicants:

Dow Toray Co., Ltd., Tokyo, JP;

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Hiroshi Fukui, Ichihara, JP;

Takeaki Tsuda, Ichihara, JP;

Hua Ren, Shanghai, CN;

Assignees:

Dow Toray Co., Ltd., Tokyo, JP;

Dow Silicones Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 183/08 (2006.01); C08G 77/08 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/24 (2006.01); C08J 5/18 (2006.01); C08K 5/01 (2006.01); C08K 5/03 (2006.01); C08K 5/07 (2006.01); C08K 5/14 (2006.01); C08K 5/5419 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
C09D 183/08 (2013.01); C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/24 (2013.01); C08J 5/18 (2013.01); C08K 5/01 (2013.01); C08K 5/03 (2013.01); C08K 5/07 (2013.01); C08K 5/14 (2013.01); C08K 5/5419 (2013.01); C08L 83/04 (2013.01); C08K 2201/019 (2013.01); C08L 2203/16 (2013.01); C08L 2312/06 (2013.01); C08L 2312/08 (2013.01);
Abstract

Provided is a curable organopolysiloxane composition for forming a film capable of uniform and thin film formation, and a method of manufacturing an organopolysiloxane cured film using the same. The curable organopolysiloxane composition for forming a film, comprises: a curing reactive organopolysiloxane, a curing agent, and one or more type of organic solvent selected from (D1) organic polar solvents, (D2) low molecular weight siloxane solvents, and (D3) halogen solvents, or a mixed solvent thereof. The viscosity of the entire composition measured at a shear rate of 0.1 (s) at 25° C. is 100,000 mPa·s or less, the viscosity of the entire composition measured at a shear rate of 10.0 (s) is within a range of 5 to 10,000 mPa·s, and a thixotropic ratio thereof is 25.0 or less.


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