The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Dec. 21, 2021
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventor:

Shu-Hao Chang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C08J 5/24 (2006.01); C08L 79/08 (2006.01); C09J 7/30 (2018.01); C09J 171/12 (2006.01);
U.S. Cl.
CPC ...
C08L 71/12 (2013.01); B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); C08J 5/244 (2021.05); C08L 79/085 (2013.01); C09J 7/30 (2018.01); C09J 171/12 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/206 (2013.01); C08J 2371/12 (2013.01); C08J 2479/08 (2013.01); C09J 2400/14 (2013.01); C09J 2400/163 (2013.01); C09J 2471/00 (2013.01); C09J 2479/08 (2013.01);
Abstract

The present invention provides a resin composition comprising maleimide-containing pre-polymerized resin and article made therefrom. The resin composition comprises: 100 weight parts of vinyl-containing polyphenylene ether resin; 35 to 45 weight parts of bis(vinylphenyl)ethane; and 30 to 60 weight parts of maleimide-containing pre-polymerized resin; wherein the maleimide-containing pre-polymerized resin is obtained by pre-polymerization of aromatic maleimide resin and long chain maleimide resin. The articles made from the resin composition improve at least one characteristic of glass transition temperature variation, copper foil peeling strength, percentage of thermal expansion, coefficient of thermal expansion and surface appearance.


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