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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12122885 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

Mar. 26, 2021

Resin particles, electrically conductive particles, electrically conductive material, and connection structure

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Kouki Ookura, Osaka, JP;

Takeshi Wakiya, Osaka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Ronak C Patel

Int. Cl.
CPC ...
C08J 3/12 (2006.01); C08F 20/14 (2006.01); C08F 22/40 (2006.01); C08K 3/08 (2006.01); C08K 9/10 (2006.01); C08L 71/12 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); G02F 1/1339 (2006.01); H01B 1/22 (2006.01); H01L 23/00 (2006.01); H01R 4/04 (2006.01);
U.S. Cl.
CPC ...
C08J 3/128 (2013.01); C08F 20/14 (2013.01); C08F 22/40 (2013.01); C08K 3/08 (2013.01); C08K 9/10 (2013.01); C08L 71/123 (2013.01); C23C 18/1641 (2013.01); C23C 18/32 (2013.01); G02F 1/13398 (2021.01); H01B 1/22 (2013.01); H01L 24/29 (2013.01); H01R 4/04 (2013.01); C08J 2379/08 (2013.01); C08K 2003/0862 (2013.01); C08K 2201/005 (2013.01); C08L 2205/03 (2013.01); G02F 2202/022 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/2939 (2013.01); H01L 2924/061 (2013.01); H01L 2924/0615 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0675 (2013.01); H01L 2924/069 (2013.01); H01L 2924/07025 (2013.01);
Abstract

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mmor more and 2,500 N/mmor less, and a 30% K value at 25° C. of 100 N/mmor more and 1,500 N/mmor less.

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