The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Mar. 16, 2022
Applicant:

Enplas Corporation, Saitama, JP;

Inventors:

Ken Kitamoto, Saitama, JP;

Ryoya Nakamura, Saitama, JP;

Assignee:

Enplas Corporation, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00071 (2013.01); B81C 2201/034 (2013.01);
Abstract

A manufacturing method capable of manufacturing a laminate including a substrate having a recess and a film with a high yield is provided. The method of manufacturing a laminate of the present invention includes: preparing a substrate having a recess; disposing a film on the substrate so as to cover the recess; and obtaining a laminate by thermocompression bonding between the film and the substrate by pressing the film and the substrate with a first elastic body and a second elastic body in a state in which the substrate on which the film is disposed is disposed between the first elastic body and the second elastic body such that the film is on the first elastic body side, in which the first elastic body is harder than the second elastic body.


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