The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
May. 23, 2023
Han-ching Huang, Taipei, TW;
Sheng-hung Lee, Taipei, TW;
Jung-chin Wu, Taipei, TW;
Kuo-nan Ling, Taipei, TW;
Chih-wen Chiang, Taipei, TW;
Chien-chu Chen, Taipei, TW;
Han-Ching Huang, Taipei, TW;
Sheng-Hung Lee, Taipei, TW;
Jung-Chin Wu, Taipei, TW;
Kuo-Nan Ling, Taipei, TW;
Chih-Wen Chiang, Taipei, TW;
Chien-Chu Chen, Taipei, TW;
COMPAL ELECTRONICS, INC., Taipei, TW;
Abstract
A composite material structure, including an outer layer, an inner layer, and a middle layer, is provided. The outer layer includes a metallic material. The inner layer includes a fiber material and a resin material. The outer layer has a first thickness, the inner layer has a second thickness, and the first thickness is different from the second thickness. The middle layer includes an adhesive material and is disposed between the outer layer and the inner layer. Two opposite surfaces of the middle layer are respectively in direct contact with the outer layer and the inner layer. A manufacturing method of the composite material structure is also provided.