The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Jun. 23, 2018
Toyo Kohan Co., Ltd., Tokyo, JP;
Toyo Seikan Co., Ltd., Tokyo, JP;
Yuuto Ooshima, Kudamatsu, JP;
Masami Suenaga, Kudamatsu, JP;
Satoshi Kawamura, Kudamatsu, JP;
Yuji Funagi, Yokohama, JP;
Shiori Adachi, Yokohama, JP;
Shigeya Takahashi, Yokohama, JP;
Yasuhiro Yukawa, Yokohama, JP;
TOYO SEIKAN CO., LTD., Tokyo, JP;
TOYO KOHAN CO., LTD., Tokyo, JP;
Abstract
[Problem] To provide: a resin-coated metallic plate which cannot undergo the occurrence of a retort brushing phenomenon (the formation of white spots) or the delamination of a film under retort sterilization treatment conditions; and others. [Solution] A resin-coated metallic plate having a resin layer (A) and a resin layer (B) is characterized in that the resin layer (A) contains 50 to 80 wt % of a polyethylene terephthalate-based resin (I) and 20 to 50 wt % of a polybutylene terephthalate-based resin (II), wherein the resin layer (B) contains 50 to 80 wt % of a polyethylene terephthalate-based resin (III) and 20 to 50 wt % of a polybutylene terephthalate-based resin (II), the polyethylene terephthalate-based resin (I) has a melting point of 210 to 230° C. inclusive, the polybutylene terephthalate-based resin (II) has a melting point of 215 to 225° C. inclusive, and the polyethylene terephthalate-based resin (III) has a melting point of higher than 230° C. and 205° C. or lower.