The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

Nov. 19, 2020
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Hidefumi Fujita, Tokyo, JP;

Koji Tanoue, Tokyo, JP;

Keisuke Yamada, Tokyo, JP;

Tetsuya Kawahito, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2022.01); B22F 1/14 (2022.01); B22F 1/16 (2022.01); H01F 1/147 (2006.01);
U.S. Cl.
CPC ...
B22F 1/16 (2022.01); H01F 1/14766 (2013.01); B22F 2301/35 (2013.01); B22F 2302/256 (2013.01);
Abstract

A silicon oxide-coated soft magnetic powder, in which the ratio of a volume-based cumulative 50% particle diameter D50 (HE) according to a dry laser diffraction particle size distribution analysis to the same particle diameter D50 (MT) according to a wet laser diffraction particle size distribution analysis is 0.7 or more, and a coverage ratio R defined by R=Si×100/(Si+M) (Si and M are molar fractions of Si and elements constituting the soft magnetic powder) is 70% or more is obtained by subjecting a slurry containing a soft magnetic powder containing 20 mass % or more of iron and a hydrolysate of a silicon alkoxide to a dispersion treatment when the surface of the soft magnetic powder is coated with the hydrolysate in a mixed solvent of water and an organic substance. The powder has good insulation/dispersibility properties and a high filling factor during molding.


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