The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2024

Filed:

May. 06, 2020
Applicant:

Magna International Inc., Aurora, CA;

Inventors:

Cangji Shi, Vaughan, CA;

Eric Denijs, Toronto, CA;

Pascal Charest, Caledon East, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 1/25 (2006.01); B21D 22/02 (2006.01); C21D 1/42 (2006.01); C21D 1/673 (2006.01); C21D 7/13 (2006.01); C21D 8/04 (2006.01); C21D 9/48 (2006.01); C21D 11/00 (2006.01);
U.S. Cl.
CPC ...
B21D 22/022 (2013.01); C21D 1/25 (2013.01); C21D 1/42 (2013.01); C21D 1/673 (2013.01); C21D 7/13 (2013.01); C21D 8/0421 (2013.01); C21D 8/0447 (2013.01); C21D 9/48 (2013.01); C21D 11/00 (2013.01);
Abstract

A system for producing components by hot forming includes a conductive post-furnace heat station, a furnace, a computer system, and a press. The computer system comprises one or more physical processors operatively connected with the furnace in and the conductive post-furnace heat station. The one or more physical processors being programmed with computer program instructions which, when executed cause the computer system to control the furnace to heat the blank to a temperature that is below AC3 temperature; and control the conductive post-furnace heat station to heat a portion of the heated blank to a temperature above the AC3 temperature by thermal conduction. The press is constructed and arranged to receive the post-heated blank from the post-furnace heat station and to form the post-heated blank into the shape of the component.


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