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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12121715 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

Mar. 01, 2018

Printed lead

Applicant:

Saluda Medical Pty Limited, Artarmon, AU;

Inventors:

John Louis Parker, Artarmon, AU;

Mohammadjavad Sadeghi, Artarmon, AU;

Peter Scott Vallack Single, Artarmon, AU;

Assignee:

Saluda Medical Pty Limited, Macquarie Park, AU;

Attorney:

Barnes & Thornburg LLP

Primary Examiner:

Alex A Rolland

Int. Cl.
CPC ...
A61N 1/04 (2006.01); A61N 1/05 (2006.01); A61N 1/375 (2006.01); B29C 64/118 (2017.01); B29C 64/245 (2017.01); B29C 64/295 (2017.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); H01B 1/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0488 (2013.01); A61N 1/05 (2013.01); B29C 64/118 (2017.08); B29C 64/245 (2017.08); B29C 64/295 (2017.08); B32B 3/30 (2013.01); B32B 7/12 (2013.01); H01B 1/00 (2013.01); H05K 3/1241 (2013.01); A61N 1/3752 (2013.01); B32B 2037/1253 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12);
Abstract

A method () of manufacturing a lead for an implantable medical device. The method includes: depositing () a base layer () of biocompatible, electrically non-conductive material; depositing () one or more complementary layers () of biocompatible, electrically non-conductive material to the base layer (), wherein the base layer () and complementary layer () form at least one slot (); and depositing () biocompatible, electrically conductive material () into the slot (). There is also disclosed a lead for an implantable medical device and an apparatus () to manufacture the lead.

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