The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12120966 B1

Date of Patent:

Oct. 15, 2024

Filed:

Sep. 02, 2022

Low footprint resonator in flip chip geometry

Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Julian Shaw Kelly, Santa Barbara, CA (US);

Evan Jeffrey, Santa Barbara, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Scott B Geyer

Int. Cl.

CPC ...

H10N 60/80 (2023.01); G06N 10/00 (2022.01); H01P 3/00 (2006.01); H01P 5/02 (2006.01); H01P 11/00 (2006.01); H10N 60/01 (2023.01); H10N 60/12 (2023.01); H10N 60/85 (2023.01);

U.S. Cl.

CPC ...

H10N 60/805 (2023.02); G06N 10/00 (2019.01); H01P 3/003 (2013.01); H01P 5/022 (2013.01); H01P 5/028 (2013.01); H01P 11/001 (2013.01); H10N 60/0912 (2023.02); H10N 60/12 (2023.02); H10N 60/85 (2023.02);

Abstract

A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

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