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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12120927 B1

PDFFull Text
Date of Patent:
Oct. 15, 2024

Filed:

Sep. 28, 2018

Display device including bending portion with frame flattening film and slits

Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Ryosuke Gunji, Sakai, JP;

Tohru Okabe, Sakai, JP;

Shinsuke Saida, Sakai, JP;

Hiroki Taniyama, Sakai, JP;

Shinji Ichikawa, Sakai, JP;

Akira Inoue, Yonago, JP;

Yoshihiro Nakada, Yonago, JP;

Hiroharu Jinmura, Yonago, JP;

Koji Tanimura, Yonago, JP;

Yoshihiro Kohara, Yonago, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, JP;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H10K 59/12 (2023.01); H10K 59/124 (2023.01); H10K 71/00 (2023.01); H10K 50/15 (2023.01); H10K 50/16 (2023.01); H10K 50/17 (2023.01); H10K 50/844 (2023.01); H10K 59/122 (2023.01); H10K 59/131 (2023.01); H10K 59/35 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/124 (2023.02); H10K 71/00 (2023.02); H10K 50/15 (2023.02); H10K 50/16 (2023.02); H10K 50/17 (2023.02); H10K 50/171 (2023.02); H10K 50/844 (2023.02); H10K 59/12 (2023.02); H10K 59/1201 (2023.02); H10K 59/122 (2023.02); H10K 59/131 (2023.02); H10K 59/35 (2023.02); H10K 59/352 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02);
Abstract

A TFT layer and an organic EL element layer are provided in this order on a resin substrate layer, the TFT layer includes source wiring lines, high-level power source wiring lines, conductive portions including connection wiring lines between TFTs, and a flattening film covering the conductive portions provided on the interlayer insulating film, a frame region is provided with a bending portion including a portion where a slit is formed in an inorganic insulating film including the interlayer insulating film, and a flattening auxiliary film is provided between each adjacent ones of the conductive portions, formed of a material identical to a material of the frame flattening film that fills the slit of the bending portion, in a layer identical to a layer of the frame flattering film, and covered with the flattening film together with the conductive portions.

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