The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Sep. 22, 2021
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;

Inventors:

Yoshiharu Yanagi, Kyoto, JP;

Hiroshi Tajima, Kyoto, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H05K 1/023 (2013.01);
Abstract

An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided. An electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, wherein the electroconductive particles contain flaky electroconductive particles and spherical electroconductive particles, the average particle size of the spherical electroconductive particles is 1 to 10 μm, the content of the flaky electroconductive particles and the spherical electroconductive particles in the electroconductive adhesive layer is 70 to 80% by weight, the weight ratio of the flaky electroconductive particles to the spherical electroconductive particles, [flaky electroconductive particles]/[spherical electroconductive particles], is 6/4 to 8/2, and the thickness of the electroconductive adhesive layer is 5 to 20 μm.


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