The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Jan. 26, 2022
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Ryosuke Takada, Nagaokakyo, JP;
Michiharu Nishimura, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 3/26 (2006.01); B32B 27/08 (2006.01); C08J 5/04 (2006.01); C08J 5/18 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0346 (2013.01); B32B 3/263 (2013.01); B32B 27/08 (2013.01); C08J 5/04 (2013.01); C08J 5/18 (2013.01); H05K 1/0271 (2013.01); H05K 1/034 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); H05K 3/4626 (2013.01); C08J 2325/04 (2013.01); C08J 2327/12 (2013.01); C08J 2365/00 (2013.01); H05K 1/118 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/068 (2013.01); H05K 2203/065 (2013.01);
Abstract
A resin multilayer substrate that includes a substrate having a plurality of laminated resin layers containing a norbornene-based polymer. A resin layer has an altered portion altered by a surface treatment and formed at an interface with a resin layer adjacent thereto in a lamination direction. An adhesion at an interface having the altered portion is greater than an adhesion at an interface with a non-altered portion.