The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Jan. 16, 2020
Applicant:

National University of Singapore, Singapore, SG;

Inventors:

Chee Keong Tee, Singapore, SG;

Yue Zhao, Singapore, SG;

Yu Jun Tan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H01B 1/22 (2013.01); H05K 1/09 (2013.01); H05K 3/4092 (2013.01); H05K 2201/10287 (2013.01);
Abstract

A stretchable interconnect structure for electrically connecting electronic devices and a method of fabricating a stretchable interconnect structure for electrically connecting electronic devices. The method comprises the steps of providing an electrically conductive wire having a 3-dimensional helical form; and embedding the electrically conductive wire in a substrate made from an elastic material.


Find Patent Forward Citations

Tee, Chee. (2024). Stretchable interconnect structure and method of fabricating the same (U.S. Patent No. 12120814). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12120814

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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