The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Aug. 04, 2020
Applicant:

Elux Inc., Vancouver, WA (US);

Inventors:

Kenji Sasaki, West Lynn, OR (US);

Paul J. Schuele, Washougal, WA (US);

Assignee:

eLux, Inc., Vancouver, WA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/32 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/3185 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/60 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95136 (2013.01); H01L 2224/95143 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15157 (2013.01); H01L 2933/005 (2013.01);
Abstract

A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.


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