The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Apr. 26, 2019
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventors:
Tomohisa Aoki, Sakai, JP;
Hiroaki Furukawa, Sakai, JP;
Yuhichi Saitoh, Sakai, JP;
Atsushi Hachiya, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/12 (2023.01); H01L 29/786 (2006.01); H10K 59/121 (2023.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H01L 29/78672 (2013.01); H01L 29/7869 (2013.01); H10K 59/1213 (2023.02); H10K 59/1216 (2023.02); H10K 59/131 (2023.02);
Abstract
An oxide semiconductor layer includes a second channel region and a second conductor region. The lower metal layer includes a contact wire in contact with the second conductor region. The upper metal layer includes an upper wire. A second interlayer insulating film is provided with a second contact hole overlapping an upper wire and the contact wire. The second conductor region and the upper wire electrically connect together through the contact wire.