The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Feb. 23, 2021
Fuji Electric Co., Ltd., Kawasaki, JP;
Sho Nakagawa, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A method for manufacturing a semiconductor device includes: forming a trimming element inside or over a semiconductor substrate; forming an insulating film on the trimming element; forming, on the insulating film, a first wiring layer connected to one end of the trimming element via a first contact region penetrating the insulating film; forming, on the insulating film, a second wiring layer connected to another end of the trimming element via a second contact region penetrating the insulating film; trimming the trimming element; and examining an insulated state between the semiconductor substrate and either the first wiring layer or the second wiring layer after the trimming.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile