The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Sep. 20, 2019
Hitachi Astemo, Ltd., Hitachinaka, JP;
Binti Haridan Fatin Farhanah, Hitachinaka, JP;
Takayuki Yogo, Hitachinaka, JP;
Hiroyuki Abe, Hitachinaka, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board, a chip packagein which a flow rate detection elementis sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portionthat fixes the chip package to the circuit board by soldering, and a positioning portionthat performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.