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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12119280 B1

PDFFull Text
Date of Patent:
Oct. 15, 2024

Filed:

Apr. 18, 2022

Semiconductor device package with reduced stress

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Gregory Thomas Ostrowicki, Dallas, TX (US);

Amit Sureshkumar Nangia, Murphy, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Dawn Jos

Frank D. Cimino

Primary Examiner:

Didarul A Mazumder

Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/561 (2013.01); H01L 23/3114 (2013.01); H01L 23/49861 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01);
Abstract

A described example includes: a semiconductor device die with an active surface; the semiconductor device die mounted on a package substrate with substrate leads and the semiconductor device die electrically coupled to the substrate leads; at least a first rigid low expansion material (RLEM) covering a portion of the semiconductor device die; and the first RLEM, the semiconductor device die, and a portion of the substrate leads covered with mold compound and forming a packaged semiconductor device die.

Find Patent Forward Citations

Ostrowicki, Gregory. (2024). Semiconductor device package with reduced stress (U.S. Patent No. 12119280). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12119280

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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