The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Oct. 21, 2019
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Syunsuke Hirano, Yamagata, JP;

Yoshihiro Kato, Fukushima, JP;

Takaaki Ogashiwa, Yamagata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 21/4857 (2013.01); H01L 23/3735 (2013.01); H05K 1/036 (2013.01); H05K 3/4682 (2013.01);
Abstract

A method for producing a package substrate for mounting a semiconductor device includes:


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