The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
May. 01, 2020
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 17/00 (2006.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/32 (2013.01); H01F 17/0013 (2013.01); H01F 27/022 (2013.01); H01F 27/28 (2013.01); H01F 27/292 (2013.01); H01F 41/04 (2013.01); H01F 2017/0026 (2013.01); H01F 2017/004 (2013.01);
Abstract
A method for manufacturing an electronic component comprises a step of forming an intermediate body including an insulator containing a resin and a conductive main body provided inside the insulator. The method further includes a step of forming an external electrode provided on the intermediate body and electrically coupled to the conductive main body. The method further includes a step of oxidizing the conductive main body, after forming the intermediate body including the insulator and the main body provided inside the insulator, to form an outer coating film on at least a part of a peripheral surface of the conductive main body.