The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Sep. 02, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Min-Cheol Kang, Hwaseong-si, KR;

Do-Nyun Kim, Seoul, KR;

Jaehoon Kim, Seoul, KR;

Woojoo Sim, Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06N 3/045 (2023.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); G06T 7/97 (2017.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20221 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Disclosed is a wafer defect inference system, which includes a test equipment that receives a first image obtained by imaging circuit patterns formed on a semiconductor wafer by using a scanning electron microscope and a second image obtained by imaging a layout image of a mask for implementing the circuit pattern on the semiconductor wafer and combines the first image and the second image to generate a combination image, and at least one computing device that is capable of communicating with the test equipment and infers a defect associated with the circuit pattern formed on the semiconductor wafer. The computing device receives the combination image, performs machine learning for inferring the defect based on the combination image, and generates an output image including information about the defect based on the machine learning.


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